The MicroLab 20 is a fast and reliable micrograph laboratory solution for quick analysis on wires ranging from 0.05 mm² to 80 mm², with customizable reporting options.
Large wire processing range
The MicroLab 20 can cut a wider range of wires compared to its predecessor, ranging from 0.05 mm² to 80 mm², making it an ideal choice for high-mix low-volume applications.
|Specification name||Specification value|
|Cutting wheel thickness||0.5 mm|
|Feed Rate Polishing Module||~6 mm/s|
|Adhesive sandpaper outer diameter||125 mm|
|Cutting wheel inner diameter||12.7 mm|
|Cutting wheel outer diameter||127 mm|