THE WAY TO MAKE IT

Edge sealing

Introduction

We protect your CI(G)S, CdTe as well as a-Si/ì-morph substrates reliable from moisture. You can choose between two approved techniques: precise laying of a butyl sealing tape using our tape application system or dispensing of butyl via hotmelt.
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Key features:

  • Precise cutting and placing of butyl tape
  • No production interruption during change of material
  • Adjustable overlap in the corner
  • Accurate middle positioning
  • Compact design

Function

The substrate is fed into the machine and is positioned in the center. Then the butyl tape is applied to all four sides of the substrate with an adjustable overlapp at the edge. An optical monitoring of the process is optionally possible. Thanks to a special material feeding system, material change is done while production. This means that a material change causes no production interruption.

Technical Data

Cycle time <60s
Control system
  • TopControl: graphical user interface with touch panel
  • Software SPS with Beckhoff control system
Dimensions (WxHxD) 4700 x 2200 x 2300 mm
Electrical connection 3 x 400V, 2kVA
 

For more information please contact:

Komax AG Rotkreuz, Switzerland
phone.: +41 41 799 45 00
mailto: Info Komax AG, Rotkreuz
 

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