Xcell GL30

Komax Solar Inc. is proud to announce the release of the next generation Xcell String to Glass Lay-up System, the Xcell-GL30.  This Lay-up System features a six axis robotic handling system, providing an extremely flexible process environment and minimizing installation, setup and change over time. This scalable system is designed to unload strings from one Xcell X2 solar cell interconnection platform and load them onto glass with EVA (+/-0.3 mm accuracy), tray buffers or onto a matrix tray for complete flexibility of your product.  To protect your valuable solar cells the Lay-up System drastically reduces handling by using a combination of Bernoulli/vacuum grippers and an inline vision system.

The Lay-up System features a new string vision inspection process unaffected by ambient light that yields a quicker cycle time, improving the throughput of the factory (1,200- 1,300 solar cells per hour).  The string is inspected for chips, cracks, individual cell defects and position for future placement on the glass/Eva.  All of this is done in a vision tunnel equipped with a high resolution camera, using red LED light sources, capable of high speed pictures.

The load while run string trays yields more machine run time per year.  Three drawer units with trays are included in each system for use in processing strings; one tray is for suspect strings as found by the vision inspection system, two additional trays are used for buffering and introducing reworked/repaired strings into the process.

Ergonomic glass/EVA load and unload conveyor is included.  Glass size consists of 300 mm x 900 mm up to 1, 000 mm x 2,000 mm in either 6 x 10 cell or 10 x 6 string arrangements.

The Lay-up System is designed to communicate with the SCADA system located on the Xcell X2 solar cell interconnection platform which collects data about the material, recipe, performance, and process variables for optimized use.

The Xcell String to Glass Lay-up System can be upgraded to include the Komax EL tester, capable of IV curve measurement, micro-crack detection and missing region identification.